Crystal growth technique for composite resin bonding. A SEM study.

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dc.contributor.authorSathyanarayanan, Ren_US
dc.date.accessioned2009-05-28T07:41:53Z
dc.date.available2009-05-28T07:41:53Z
dc.date.issued1998-07-26en_US
dc.description.abstractThis study aimed to compare the surface structure of the exposed enamel and dentine treated with acid etching and various concentrations of crystal growth agents (CGA) under Scanning Electron Microscope (SEM). Fifteen maxillary central incisors which fulfilled the inclusion and exclusion criteria were used as samples. The acid used for etching the enamel was 37% orthophosphoric acid and CGA's were 2%, 5% and 10% for micacid saturated with ammonium sulfate. The samples were divided into 5 groups and expect control group others were subjected to various surface treatments. They were observed under SEM at X 1000 magnification. The acid etched enamel surface structure was similar to the previously published reports. Maximum crystal growth on enamel and dentin were observed with 5% CGA. The surface irregularity produced by crystals were similar to acid etched surface.en_US
dc.description.affiliationDepartment of Conservative Dentistry & Endodontics, Mahatma Gandhi Dental College, Pondicherry, India.en_US
dc.identifier.citationSathyanarayanan R. Crystal growth technique for composite resin bonding. A SEM study. Indian Journal of Dental Research. 1998 Jul-Sep; 9(3): 99-103en_US
dc.identifier.urihttps://imsear.searo.who.int/handle/123456789/51536
dc.language.isoengen_US
dc.source.urihttps://www.ijdr.inen_US
dc.subject.meshAcid Etching, Dentalen_US
dc.subject.meshAdulten_US
dc.subject.meshCrystallizationen_US
dc.subject.meshDental Enamel --drug effectsen_US
dc.subject.meshDentin --drug effectsen_US
dc.subject.meshFormic Acids --pharmacologyen_US
dc.subject.meshHumansen_US
dc.subject.meshMicroscopy, Electron, Scanningen_US
dc.subject.meshMiddle Ageden_US
dc.subject.meshPhosphoric Acids --pharmacologyen_US
dc.subject.meshResin Cementsen_US
dc.titleCrystal growth technique for composite resin bonding. A SEM study.en_US
dc.typeJournal Articleen_US
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